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揚杰股份官網主頁
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6寸晶圓
ESD防護芯片
ESD防護芯片

Product status

Unidirectional/bidirectional

Channel

Top Metal

Back Metal

Die Size

Die Size (Width/um)

Wafer Saw(um)

Thickness(um)

Vrwm(V)

Vbr(V@1mA)

IR(uA)

Cj(pf)

Ipp(A)

Vcc(V@Ippmax)

ESD(kV)

??
型號 pdf Unidirectional
/bidirectional
Channel Top Metal Back Metal Die Size (Length/um) Die Size (Width/um) Wafer Saw(um) Thickness(um) Vrwm(V) Vbr(V@1mA) IR(uA) Cj(pf) Ipp(A) Vcc(V@Ippmax) ESD(kV) 產品狀態

條數據

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